Intel Corporation will put its 300-mm wafer fabrication plant in Dalian into production in October.
The project, with a total investment of USD 6 billion, will include a USD 2.5 billion 12-inch chip production line in the first phase and USD 3.5 billion supporting facilities composed of a 12-inch chip production base, four assembling and testing plants, a R&D center, and a sales division in the second phase.
The first phase of the project is expected to bring in as much as CNY 20 billion sales revenue a year after starting operation at the beginning of 2009, according to Mr. Dai, noting that the Phase II project was scheduled to break earth in mid 2009. The chipmaker has hired more than 4,000 employees for its plant in Dalian since it entered into an agreement with the municipal government in the production base in 2007.
The Santa Clara, California-based company has a 90-nanometer chip assembling plant in Chengdu, Sichuan Province, western China.
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